RM 56: A Conversation about Solder Voiding with Solder Materials, Stencil, and Cleaning Experts - a podcast by UP Media Group

from 2020-12-02T09:53:26

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Voiding is the cause of multiple failure mechanisms. Mike Konrad speaks with solder material expert Tim O'Neill of Aim Solder, stencil manufacturer Prakash Gango of StenTech, and cleaning materials manufacturer Kalyan Nukala of Zestron about how solder voiding leads to product failures and methods to reduce voiding.



 



The guests may be reached here:



Tim O'Neill



AIM Solder



toneill@aimsolder.com



www.aimsolder.com



 



Prakash Gango



StenTech



prakash@stentech.com



www.stentech.com



 



Kalyan Nukala



Kalyan.Nukala@zestronusa.com



www.zestron.com

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